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With picosecond laser, ultra-short pulse processing with almost no heat transfer, suitable for high-speed cutting and drilling of any organic and inorganic materials with minimum 3μm chipping and heat-affected zone. It can process materials such as silver paste, ITO, Cu, glass, sapphire, ceramic, ultra-thin metal sheet, polymer composite material, silicon wafer, and various alloy materials and thin film materials, CCD visual pre-scan & automatic target positioning, maximum processing range of 500×400m, XY platform splicing accuracy ≤±3μm, excellent beam quality and long-term working stability.
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The company's main industries include medical industry, automotive industry, new energy industry, consumer electronics industry, hardware industry.
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